{"id":5396,"date":"2022-09-13T00:00:00","date_gmt":"2022-09-12T15:00:00","guid":{"rendered":"https:\/\/www.first.iir.isct.ac.jp\/detail_1346\/"},"modified":"2022-09-13T00:00:00","modified_gmt":"2022-09-12T15:00:00","slug":"detail_1346","status":"publish","type":"post","link":"https:\/\/www.first.iir.isct.ac.jp\/en\/detail_1346\/","title":{"rendered":"Accelerating social implementation of next-generation 3D stacked semiconductor technology: Prof. Takayuki Ohba"},"content":{"rendered":"<p><span style=\"font-size: 16px;\"><strong>Tokyo Tech WOW Alliance and NCKU Agree on Technical Partnership for 3D Integrated Technology based on BBCube<\/strong><\/span><\/p>\n<p><\/p>\n<div style=\"border: 10px solid #043c78 solid 1px; border-left: #043c78 solid 10px; padding: 5px; background: #043c78; font-size: 60%;\"><span style=\"font-size: 16px;\"><strong><span style=\"color: #ffffff;\">Main Point<\/span><\/strong><\/span><\/div>\n<p><\/p>\n<p class=\"mb10\">\n<p><\/p>\n<ul>\n<li><span>Tokyo Institute of Technology (Tokyo Tech) WOW Alliance and the National Cheng Kung University (hereinafter, NCKU) agree on a technical partnership to promote the social implementation (practical application) of next-generation 3D integrated technology based on BBCube.<\/span><\/li>\n<li><span>NCKU joins Tokyo Tech WOW Alliance to promote research and development of next-generation 3D technology. A pilot manufacturing line will be established and operated at NCKU, in addition to human resource development.<\/span><\/li>\n<li class=\"last\"><span>NCKU concludes BBCube business alliance with TECH EXTENSION Co., Ltd. (hereinafter, TEX. Established by Tokyo Tech Specially Appointed Professor Takayuki Ohba). TEX will transfer to NCKU the WOW and COW technologies, which are based on the BBCube platform.<\/span><\/li>\n<li><span>Strengthening the semiconductor supply chain through the Tokyo Tech WOW Alliance and Japan-Taiwan BBCube business alliance. A huge leap forward for the social implementation of post-miniaturization next-generation 3D integrated technology.<\/span>\n<\/li>\n<\/ul>\n<p><\/p>\n<div style=\"border: 10px solid #043c78 solid 1px; border-left: #043c78 solid 10px; padding: 5px; background: #043c78; font-size: 60%;\"><span style=\"color: #ffffff; font-size: 16px;\"><strong>Overview<\/strong><\/span><\/div>\n<p><\/p>\n<p class=\"mb10\">\n<p><\/p>\n<p class=\"mb20\">The Tokyo Institute of Technology <a href=\"https:\/\/www.titech.ac.jp\/english\/news\/2022\/065169#blk1-note1\" id=\"blk1-note1u\" title=\"This is an industry-academia research platform operated by the Heterogeneous and Functional Integration Unit (Ohba Laboratory) of the Institute of Innovative Research, Tokyo Tech. It consists of companies and research institutes that handle design, processing, equipment, and materials related to semiconductors. As the only R&amp;D platform in Japan focused on 3D integration of semiconductors, it pioneered simple wafer thinning and stacking technology with 300 mm wafers. It is also the first in the world to successfully develop 3D technology with bumpless TSV wiring.\" class=\"scroll\">WOW Alliance<\/a> and <a href=\"https:\/\/www.titech.ac.jp\/english\/news\/2022\/065169#blk1-note2\" id=\"blk1-note2u\" title=\" This is a national university established in 1931. It is well known as a top university in the mid-south region of Taiwan, and is one of six designated national research universities. Official name: \u570b\u7acb\u6210\u529f\u5927\u5b78. Tokyo Tech and NCKU entered into an Academic Cooperation Agreement in November 1997.\" class=\"scroll\">NCKU<\/a> have agreed on a technical partnership for social implementation of <a href=\"https:\/\/www.titech.ac.jp\/english\/news\/2022\/065169#blk1-note3\" id=\"blk1-note3u\" title=\"Next-generation semiconductor technology with 3D integration at the wafer level. Based on the ultra-thinning technology and bumpless vertical wiring technology owned by the WOW Alliance, it is possible to achieve 3D integration with semiconductors that allows for higher performance and lower power consumption than with conventional products. In addition to large-scale computing devices such as servers, the size of mounted multifunction device systems can be greatly reduced.\" class=\"scroll\">Next-generation 3D integrated technology<\/a> based on <a href=\"https:\/\/www.titech.ac.jp\/english\/news\/2022\/065169#blk1-note4\" id=\"blk1-note4u\" title=\"Architecture allowing systems to be minimized without the use of bumps. It is a compact 3D version of a chiplet, which are conventionally a flat plane. Reference: Ohba, T.; Sakui, K.; Sugatani, S.; Ryoson, H.; Chujo, N. Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI). Electronics 2022, 11, 236. https:\/\/doi.org\/10.3390\/electronics11020236\" class=\"scroll\">BBCube (Bumpless Build Cube)<\/a>. This is the first Japan-Taiwanese academia alliance for next-generation 3D integration processes. Plans to achieve commercialization will proceed through the BBCube business alliance. NCKU has joined the Tokyo Tech WOW Alliance to participate in research and development of next-generation 3D technology. This includes the construction and testing of a BBCube pilot manufacturing line within the university, as well as developing the necessary human resources for its operation.<\/p>\n<p><\/p>\n<p class=\"mb20\">A BBCube business alliance was concluded with TEX, a company established by Professor Takayuki Ohba of Tokyo Tech, Institute of Innovative Research. TEX will provide the transfer of <a href=\"https:\/\/www.titech.ac.jp\/english\/news\/2022\/065169#blk1-note5\" id=\"blk1-note5u\" title=\"Stacking technology that allows wafers to be directly bonded and connected to each other. This greatly helps to improve efficiency of wafer stacking of the same chip size such as for DRAM.\" class=\"scroll\">WOW Technology<\/a>, and <a href=\"https:\/\/www.titech.ac.jp\/english\/news\/2022\/065169#blk1-note6\" id=\"blk1-note6u\" title=\"Technology that connects and bonds chiplets on a wafer using WOW technology. By bonding the chips directly onto the wafer, high-precision processing can be performed using various types of wafer processing equipment in subsequent semiconductor manufacturing processes.\" class=\"scroll\">COW Technology<\/a>, both based on the BBCube platform, to NCKU. Processes, equipment, and materials will be utilized, based on the research achievements of the Tokyo Tech WOW Alliance.<\/p>\n<p><\/p>\n<p class=\"mb20\">Currently, many universities and affiliated companies are participating in the Tokyo Tech WOW Alliance, and are conducting research and development of next-generation semiconductor 3D technology. As industry is entering an age when production yields of cutting-edge semiconductor devices become saturated, due to the increase in invisible defects at the atomic scale, COW chiplet integration and WOW wafer stacking technology becomes ever more important. This Japan-Taiwan collaboration has been formed in response to this need, making product and market orientation seamless, It is expected to promote basic development of post-miniaturization 3D integrated technology and social implementation, as well as strengthening the semiconductor supply chain. The plan is to establish a pilot manufacturing line for R&amp;D at NCKU by the end of 2023, and sequentially apply WOW and COW production processes as BBCube platform technologies.<\/p>\n<p><\/p>\n<p class=\"mb20\" style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" alt=\"ooba_20220913.png\" src=\"https:\/\/www.first.iir.isct.ac.jp\/news\/ooba_20220913.png\" width=\"500\" height=\"420\" class=\"mt-image-none\"><br \/><span style=\"font-size: 12px;\">WOW Alliance and BBCube Business Alliance<\/span><\/p>\n<p><\/p>\n<h2>Contact<\/h2>\n<p><\/p>\n<p><span> <\/span>Prof. Takayuki Ohba\uff08ICE Cube Center\uff09<br \/><a href=\"http:\/\/www.wow.pi.titech.ac.jp\/\" target=\"_blank\">http:\/\/www.wow.pi.titech.ac.jp\/<\/a><br \/><a href=\"numazawa.f.aa@m.titech.ac.jp?subject=\u3010\u554f\u5408\u305b\u3011\u30d7\u30ec\u30b9\u30ea\u30ea\u30fc\u30b9\u306b\u3064\u3044\u3066&amp;body=\u3054\u8a18\u5165\u304f\u3060\u3055\u3044\" style=\"background-color: #ffffff;\"><img loading=\"lazy\" decoding=\"async\" alt=\"https:\/\/www.first.iir.isct.ac.jp\/english\/news\/uploads\/Contact.jpg\" src=\"https:\/\/www.first.iir.isct.ac.jp\/english\/news\/uploads\/Contact.jpg\" width=\"100\" height=\"30\" class=\"mt-image-none\"><\/a><\/p>\n<p><\/p>\n<div style=\"background: #f3f3f2; padding: 10px; border: none; border-radius: 10px; -moz-border-radius: 10px; -webkit-border-radius: 10px;\"><strong>Links<\/strong><br \/>\u25b6<a href=\"https:\/\/www.titech.ac.jp\/english\/news\/2022\/065169\">Tokyo Institute of Technology<\/a><br \/>\u25b6<a href=\"https:\/\/www.iir.titech.ac.jp\/en\/news\/news-3294\/\">Institute of Innovative Research\uff08IIR\uff09<\/a><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Tokyo Tech WOW Alliance and NCKU Agree on Technical Partnership for 3D Integrated Technology based on BBCube Main Point Tokyo Institute of Technology (Tokyo Tech) WOW Alliance and the National Cheng Kung University (hereinafter, NCKU) agree on a technical partnership to promote the social implementation (practical application) of next-generation 3D integrated technology based on BBCube. [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_locale":"en_US","_original_post":"https:\/\/www.first.iir.isct.ac.jp\/detail_1346\/","footnotes":"","_links_to":"","_links_to_target":""},"categories":[17],"tags":[],"class_list":["post-5396","post","type-post","status-publish","format-standard","hentry","category-press-release","en-US"],"_links":{"self":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/posts\/5396","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/comments?post=5396"}],"version-history":[{"count":0,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/posts\/5396\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/media?parent=5396"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/categories?post=5396"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/tags?post=5396"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}