{"id":2054,"date":"2025-01-21T17:32:39","date_gmt":"2025-01-21T08:32:39","guid":{"rendered":"https:\/\/www.first.iir.isct.ac.jp\/?page_id=2054"},"modified":"2025-11-21T11:18:30","modified_gmt":"2025-11-21T02:18:30","slug":"core5","status":"publish","type":"page","link":"https:\/\/www.first.iir.isct.ac.jp\/en\/member\/core5\/","title":{"rendered":"Advanced Integrated Electronics Research Core"},"content":{"rendered":"<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img decoding=\"async\" src=\"\/uploads\/ito2016.jpg\" alt=\"ito2016.jpg\" width=\"100\" \/><\/td>\n<td colspan=\"4\"><strong><a name=\"ito\"><\/a><span style=\"font-size: 16px;\">Prof. Hiroyuki ITO<\/span><\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J2<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J2-31<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">045-924-5010<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">ito(at)nasu.iir.isct.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"http:\/\/ateal.jp\/\" target=\"_blank\" rel=\"noopener\">http:\/\/ateal.jp\/<\/a><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Research Field<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Integrated Circuits, RF Circuits, Sensor Networks, IoT and Applictaion<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Objective<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Research on interface technology to connect real space and cyberspace<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Current Topics<\/strong><\/span><\/td>\n<td colspan=\"4\">\n<ul>\n<li><span style=\"font-size: 12px;\">Ultra Low Power Wireless Sensor Circuit Technology<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Low Noise Circuit Technology<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Monitoring Technology for Dairy Husbandry<\/span><\/li>\n<li><span style=\"font-size: 12px;\">IT Technology for Agriculture<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Measurement Technology for Dental Therapy<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/uploads\/reserch_ito_1.jpg\" alt=\"reserch_ito_1.jpg\" width=\"500\" height=\"334\" \/><br \/>\n<span style=\"font-size: 10px;\">Low-Phase-Noise Fractional-N Synthesizer for Wireless Communication.<\/span><\/p>\n<p style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/reserch_ito_2.jpg\" alt=\"reserch_ito_2.jpg\" width=\"500\" height=\"357\" \/><br \/>\n<span style=\"font-size: 10px;\">Monitoring Technology for Dairy Husbandry<\/span><\/p>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/tokuda_2022.jpg\" alt=\"tokuda_2022.jpg\" width=\"100\" height=\"133\" \/><\/td>\n<td colspan=\"4\"><strong><a name=\"tokuda\"><\/a><span style=\"font-size: 16px;\">Prof. Takashi TOKUDA<\/span><\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">S9<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">S9-11<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">03-5734-2211<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">tokuda(at)ee.e.titech.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"http:\/\/www.tokuda-lab.ee.e.titech.ac.jp\/index_e.html\" target=\"_blank\" rel=\"noopener\">http:\/\/www.tokuda-lab.ee.e.titech.ac.jp\/index_e.html<\/a><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Research Field<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">CMOS-based microdevices and systems<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Objective<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Development of circuit technology for ultra-small wireless devices and sensors for biomedical and IoT applications<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Current Topics<\/strong><\/span><\/td>\n<td colspan=\"4\">\n<ul>\n<li><span style=\"font-size: 12px;\">CMOS-controlled photovoltaic power transfer and energy harvesting<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Wireless, ultra-small Implantable optogenetic stimulator<\/span><\/li>\n<li><span style=\"font-size: 12px;\">IoT micronode device for &#8220;Bottom-up IoT&#8221; technology<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Implantable glucose sensor<\/span><\/li>\n<li><span style=\"font-size: 12px;\">On-chip opto-electronic image sensor<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<table class=\"tableLayout01\" border=\"0\">\n<tbody>\n<tr>\n<td style=\"text-align: center;\"><span style=\"font-size: 12px;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/uploads\/research_tokuda2019_01.jpg\" alt=\"research_tokuda2019_01.jpg\" width=\"300\" height=\"250\" \/><\/span><br \/>\n<span style=\"font-size: 10px;\">Ultra-small Implantable optogenetic stimulator<\/span><\/td>\n<td style=\"text-align: center;\"><span style=\"font-size: 12px;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/uploads\/research_tokuda2019_02.jpg\" alt=\"research_tokuda2019_02.jpg\" width=\"250\" height=\"250\" \/><\/span><br \/>\n<span style=\"font-size: 10px;\">Implantable glucose sensor<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/ohba_2022.jpg\" alt=\"ohba_2022.jpg\" width=\"100\" height=\"133\" \/><\/td>\n<td colspan=\"4\"><strong><a name=\"ohba\"><\/a><span style=\"font-size: 16px;\">Prof. Takayuki OHBA<\/span><\/strong><span style=\"font-size: 12px;\">\uff08Specially Appointed\uff09<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">S9<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">S9-11<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">03-5734-2211<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">takayuki.ohba(at)first.iir.isct.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"https:\/\/www.wow.first.iir.isct.ac.jp\/\" target=\"_blank\" rel=\"noopener\">https:\/\/www.wow.first.iir.isct.ac.jp\/<\/a><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Research Field<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">BBCube LSI Semiconductor Process Development and Applications<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Objective<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">To develop the cutting-edge BBCube three-dimensional large-scale integration technology and drive the semiconductor industry beyond scaling.<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Current Topics<\/strong><\/span><\/td>\n<td colspan=\"4\">\n<ul>\n<li><span style=\"font-size: 12px;\">Development of mass-production-ready WOW\/COW processes, equipment, and materials.<\/span><\/li>\n<li><span style=\"font-size: 12px;\">BBCube 2.5D\/3D system development.<\/span><\/li>\n<li><span style=\"font-size: 12px;\">BBCube thermal design and heat dissipation technology development.<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Wide-bandgap materials research.<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Social implementation through the WOW Alliance.<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<table class=\"tableLayout01\" border=\"0\">\n<tbody>\n<tr>\n<td style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/research_ohba_1.png\" alt=\"research_ohba_1.png\" width=\"269\" height=\"150\" \/><\/td>\n<td style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/research_ohba_2.png\" alt=\"research_ohba_2.png\" width=\"318\" height=\"150\" \/><\/td>\n<\/tr>\n<tr>\n<td style=\"text-align: center;\" colspan=\"2\"><span style=\"font-size: 10px;\">Bumpless vertical interconnects between wafers<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/uploads\/CHEN2019.jpg\" alt=\"CHEN2019.jpg\" width=\"100\" height=\"133\" \/><\/td>\n<td colspan=\"4\"><strong><a name=\"chen\"><\/a><span style=\"font-size: 16px;\">Prof. Kuan-Neng CHEN<\/span><\/strong><span style=\"font-size: 12px;\">\uff08Specially Appointed\uff09\u3014Ito Lab\u3015<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J3<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J3-132<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">045-924-5866<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">chien.k.0dea(at)m.isct.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/cms\/wp-content\/uploads\/chujo_2025.jpg\" alt=\"chujo_2025.jpg\" width=\"100\" height=\"133\" \/><\/td>\n<td colspan=\"4\"><strong><a name=\"chujo\"><\/a><span style=\"font-size: 16px;\">Prof. Norio CHUJO<\/span><\/strong><span style=\"font-size: 12px;\">\uff08Specially Appointed\uff09<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">R2\u68df<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">R2-32<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">045-924-5083<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">chuujou.n.813f(at)m.isct.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"https:\/\/www.wow.first.iir.isct.ac.jp\/\" target=\"_blank\" rel=\"noopener\">https:\/\/www.wow.first.iir.isct.ac.jp\/<\/a><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Research Field<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Design and architecture of BBCube 3D integration<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Objective<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Development of semiconductor technologies that achieve both high performance and low.<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Current Topics<\/strong><\/span><\/td>\n<td colspan=\"4\">\n<ul>\n<li><span style=\"font-size: 12px;\">Research and development of BBCube 3D systems stacking xPUs (e.g., CPUs and GPUs), memory, and voltage regulators<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Development of low-power, high-bandwidth inter-chip communication technologies for 2.5D\/3D integration<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Development of vertically integrated high-efficiency power delivery solutions<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Advanced thermal design and heat dissipation technology development <\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<table class=\"tableLayout01\" border=\"0\">\n<tbody>\n<tr>\n<td style=\"text-align: center;\"><a href=\"https:\/\/www.first.iir.isct.ac.jp\/research_chujo\/\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter size-full wp-image-6877\" src=\"https:\/\/www.first.iir.isct.ac.jp\/cms\/wp-content\/uploads\/research_chujo.jpg\" alt=\"\" width=\"500\" height=\"258\" srcset=\"https:\/\/www.first.iir.isct.ac.jp\/cms\/wp-content\/uploads\/research_chujo.jpg 500w, https:\/\/www.first.iir.isct.ac.jp\/cms\/wp-content\/uploads\/research_chujo-300x155.jpg 300w\" sizes=\"auto, (max-width: 500px) 100vw, 500px\" \/><\/a><\/td>\n<\/tr>\n<tr>\n<td style=\"text-align: center;\"><span style=\"font-size: 10px;\">BBCube 3D configuration<\/span><br \/>\n<span style=\"font-size: 10px;\">\u30fbMulti-xPU\/IVR\/Multi-Memory Vertical Stack<\/span><br \/>\n<span style=\"font-size: 10px;\">\u30fbWOW and COW Hybrid Processes<\/span><br \/>\n<span style=\"font-size: 10px;\">\u30fbCu-Damascene Via-Last TSVs)<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><span style=\"font-size: 12px;\"><img decoding=\"async\" src=\"\/uploads\/dosho.jpg\" alt=\"dosho2016.jpg\" width=\"100\" \/><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 16px;\"><strong><a name=\"dosho\"><\/a>Prof. Shiro DOSHO<\/strong><span style=\"font-size: 12px;\">\uff08Specially Appointed\uff09\u3014Ito Lab\u3015<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J2<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J2-31<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">045-924-5010<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">dosho(at)first.iir.isct.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"http:\/\/ateal.jp\/\" target=\"_blank\" rel=\"noopener\">http:\/\/ateal.jp\/<\/a><\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/english\/tnakamura_2023.jpg\" alt=\"tnakamura_2023.jpg\" width=\"100\" height=\"133\" \/><\/td>\n<td colspan=\"4\"><strong><a name=\"nakamura\"><\/a><span style=\"font-size: 16px;\">Prof. Tomoji NAKAMURA<\/span><\/strong><span style=\"font-size: 12px;\">\uff08Specially Appointed\uff09\u3014Ito Lab\u3015<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">R2<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">R2-32<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">045-924-5083<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">tomoji.nakamura(at)irst.iir.isct.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"https:\/\/www.wow.first.iir.isct.ac.jp\/\">https:\/\/www.wow.first.iir.isct.ac.jp\/<\/a> <\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Research Field<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Heat exchange and heat transport technologies in electronic products<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Objective<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Improve cooling efficiency of the overall system by dispersing, transporting, and exchanging heat generated by electronic products using gas-liquid two-phase flow.<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Current Topics<\/strong><\/span><\/td>\n<td colspan=\"4\">\n<ul>\n<li><span style=\"font-size: 12px;\">Development of cooling devices that disperse, transport, and exchanging heat generated by electronic devices with high power consumption using gas-liquid two-phase flow.<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Computational Fluid Dynamics simulation for 2-phase flow that covers evaporation, transport, and coagulation of water in an integrated manner.<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p style=\"text-align: center;\" align=\"left\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/research_nakamura_1.png\" alt=\"research_nakamura_1.png\" width=\"400\" height=\"131\" \/><br \/>\n<span style=\"font-size: 10px;\">Schematic cross section of vapor chamber (VC)<\/span><\/p>\n<p style=\"text-align: center;\" align=\"left\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" style=\"display: block; margin-left: auto; margin-right: auto;\" src=\"https:\/\/www.first.iir.isct.ac.jp\/research_nakamura_2.png\" alt=\"research_nakamura_2.png\" width=\"400\" height=\"359\" \/><span style=\"font-size: 10px;\">Heat transfer performance of the prototype VC<\/span><\/p>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/yoda_2022.jpg\" alt=\"yoda_2022.jpg\" width=\"100\" height=\"133\" \/><\/td>\n<td colspan=\"4\"><span style=\"font-size: 16px;\"><strong>Prof. Takashi YODA<\/strong><span style=\"font-size: 12px;\">\uff08Specially Appointed\uff09\u3014Ohba Lab\u3015<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">R2\u68df<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">R2-32<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">045-924-5083<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">takashi.yoda(at)first.iir.isct.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"https:\/\/www.wow.first.iir.isct.ac.jp\/\" target=\"_blank\" rel=\"noopener\">https:\/\/www.wow.first.iir.isct.ac.jp\/<\/a><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Research Field<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Wide Band Gap (WBG) Semiconductor Technology<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Objective<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Development of the High performance SiC\/(GaN) devices<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Current Topics<\/strong><\/span><\/td>\n<td colspan=\"4\">\n<ul>\n<li><span style=\"font-size: 12px;\">Defect-Free Engineering<\/span><br \/>\n<span style=\"font-size: 12px;\">\u3000- Lifetime Measurement<\/span><br \/>\n<span style=\"font-size: 12px;\">\u3000- Dislocation Modeling<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Diagnotics Technology<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Advanced Application of WBG Devices<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<table class=\"tableLayout01\" border=\"0\">\n<tbody>\n<tr>\n<td style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/research_yoda_1.png\" alt=\"research_yoda_1.png\" width=\"157\" height=\"205\" \/><\/td>\n<td style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/research_yoda_2.png\" alt=\"research_yoda_2.png\" width=\"435\" height=\"205\" \/><\/td>\n<\/tr>\n<tr>\n<td style=\"text-align: center;\"><span style=\"font-size: 10px;\">Lifetime measurement for n-Buffer SiC layer<\/span><\/td>\n<td style=\"text-align: center;\"><span style=\"font-size: 10px;\">Hyperspectral Raman Imaging of 4H-SiC BPD<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/uploads\/yskim2016.jpg\" alt=\"yskim2016.jpg\" width=\"100\" height=\"132\" \/><\/td>\n<td colspan=\"4\"><strong><a name=\"kim\"><span style=\"font-size: 16px;\">Prof. Young Suk KIM<\/span><\/strong><span style=\"font-size: 12px;\">\uff08Visiting\uff09\u3014Ito Lab\u3015<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J3<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J3-132<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">045-924-5866<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">youngsuk.k.aa(at)m.titech.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"http:\/\/www.wow.pi.titech.ac.jp\/\" target=\"_blank\" rel=\"noopener\">http:\/\/www.wow.pi.titech.ac.jp\/<\/a><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Research Field<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Process Integration Development for 3D LSI Devices<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Objective<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">To develop ultra-thinning of 300-mm device wafers and those stack process integration technology for three-dimensional LSI technology. Because the physical interconnects length becomes 1\/10 using ultra-thin wafers and Wafer-on-Wafer (WOW) process, high performance 3D devices with low power consumption will be realized.<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Current Topics<\/strong><\/span><\/td>\n<td colspan=\"4\">\n<ul>\n<li><span style=\"font-size: 12px;\">Ultra-thinning 300-mm DRAM wafer down to 2-\u03bcm<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Bumpless vertical interconnects between wafers<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Analyses of defect generation and device characteristics for thinned device wafer<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/english\/research_yskim.png\" alt=\"research_yskim.png\" width=\"400\" height=\"175\" \/><br \/>\n<span style=\"font-size: 10px;\">Thinned DRAM 300mm wafer<\/p>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/shirane_2022.jpg\" alt=\"shirane_2022.jpg\" width=\"100\" height=\"133\" \/><\/td>\n<td colspan=\"4\"><strong><a name=\"shirane\"><span style=\"font-size: 16px;\">Assoc. Prof. Atsushi SHIRANE<\/span><\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">S9<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">S3-28<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">03-5734-2888<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">shirane(at)ee.e.titech.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"https:\/\/shirane-lab.ee.e.titech.ac.jp\/\" target=\"_blank\" rel=\"noopener\">https:\/\/shirane-lab.ee.e.titech.ac.jp\/<\/a><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Research Field<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Integrated Circuits for Wireless Communication and Wireless Power Transfer<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Objective<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Creation of Integrated Circuits Technology for Wireless Communication to be Deployed in Space and Green Wireless Power Transfer<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Current Topics<\/strong><\/span><\/td>\n<td colspan=\"4\">\n<ul>\n<li><span style=\"font-size: 12px;\">RF Integrated Circuits for Small Satellite<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Battery-less Wirelessly-Powered 5G Integrated Circuits<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Radiation Hardened Wireless Transceiver, RF Fingerprints using Machine Learning, etc<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<table class=\"tableLayout01\" border=\"0\">\n<tbody>\n<tr>\n<td style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/research_shirane_1.png\" alt=\"research_shirane_1.png\" width=\"314\" height=\"250\" \/><\/span><br \/>\n<span style=\"font-size: 10px;\">Radiation Hardened Ultra-Low-Power Ka-band<br \/>\n<span style=\"font-size: 10px;\">RFIC and Wireless Transceiver for Small Satellite<\/span><\/td>\n<td><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" style=\"display: block; margin-left: auto; margin-right: auto;\" src=\"https:\/\/www.first.iir.isct.ac.jp\/research_shirane_2.png\" alt=\"research_shirane_2.png\" width=\"254\" height=\"250\" \/><\/span><span style=\"font-size: 10px;\">Spaceborne Phased-Array Transceiver on Non-Planar Deployable Membrane Structure<br \/>\n<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/english\/sugahara_2022.jpg\" alt=\"sugahara_2022.jpg\" width=\"100\" height=\"133\" \/><\/td>\n<td colspan=\"4\"><strong><a name=\"sugahara\"><span style=\"font-size: 16px;\">Assoc. Prof. Satoshi SUGAHARA<\/span><\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J3<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J3-14<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">045-924-5184<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">sugahara.s.aa(at)m.titech.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"https:\/\/www.first.iir.isct.ac.jp\/sugaharalab\/\/\">https:\/\/www.first.iir.isct.ac.jp\/sugaharalab\/<\/a><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Research Field<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Integrated devices, Integrated circuits, Micro thermoelectric generators<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Objective<\/strong><\/span><\/td>\n<td colspan=\"4\"><span style=\"font-size: 12px;\">Ultralow-power CMOS memory, Energy-efficient CMOS logic<br \/>\n<span style=\"font-size: 12px;\">Nonvolatile memory, Beyond-CMOS device, Thermoelectric generator technology<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Current Topics<\/strong><\/span><\/td>\n<td colspan=\"4\">\n<ul>\n<li><span style=\"font-size: 12px;\">Ultralow-voltage retention SRAM<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Energy minimum-point operation SRAM\/neural-network accelerator<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Thin-film micro thermoelectric generator using body heat<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Piezoelectronic transistor\uff0cNonvolatiole SRAM<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/reserch_sugahara_1.png\" alt=\"reserch_sugahara_1.png\" width=\"500\" height=\"266\" \/><br \/>\n<span style=\"font-size: 10px;\">Ultralow-voltage retention SRAM macro<\/p>\n<p style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/reserch_sugahara_2.png\" alt=\"reserch_sugahara_2.png\" width=\"500\" height=\"232\" \/><br \/>\n<span style=\"font-size: 10px;\">Nonvolatile SRAM macro<\/p>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/yamamoto_2022.jpg\" alt=\"yamamoto_2022.jpg\" width=\"100\" height=\"133\" \/><\/td>\n<td colspan=\"4\"><strong><span style=\"font-size: 16px;\">Lecturer Shuichiro YAMAMOTO<\/span><\/strong><span style=\"font-size: 12px;\">\uff08Specially Appointed\uff09\u3014Sugahara Lab\u3015<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J3<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">J3-14<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">045-924-5456<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">sh_yamamoto(at)isl.titech.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"https:\/\/www.first.iir.isct.ac.jp\/sugaharalab\/\">https:\/\/www.first.iir.isct.ac.jp\/sugaharalab\/<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/cms\/wp-content\/uploads\/saito_2025.jpg\" alt=\"saito_2025.jpg\" width=\"100\" height=\"133\" \/><\/td>\n<td colspan=\"4\"><strong><a name=\"saito\"><\/a> <span style=\"font-size: 16px;\">Asst. Prof. Masato SAITO<\/span><\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">S9<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">S9-11<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">03-5734-3811<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">saito.m.bg(at)m.titech.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"http:\/\/www.tokuda-lab.ee.e.titech.ac.jp\/\" target=\"_blank\" rel=\"noopener\">http:\/\/www.tokuda-lab.ee.e.titech.ac.jp\/<\/a><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Current Topics<\/strong><\/span><\/td>\n<td colspan=\"4\">\n<ul>\n<li><span style=\"font-size: 12px;\">Implantable flexible electronic devices for medical applications<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Polymer thin-film electronics using nanomaterial printing and transfer technology<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/cms\/wp-content\/uploads\/research_saito_2025.png\" alt=\"research_saito_2025.png\" width=\"356\" height=\"262\" \/><br \/>\n<span style=\"font-size: 10px;\">Thin-film device that generates heat by an external wireless power supply<\/span><\/p>\n<hr \/>\n<table class=\"tableLayout02\" border=\"1\">\n<tbody>\n<tr>\n<td rowspan=\"5\" align=\"center\" width=\"120\"><img loading=\"lazy\" decoding=\"async\" class=\"mt-image-none\" src=\"https:\/\/www.first.iir.isct.ac.jp\/cms\/wp-content\/uploads\/jill_2025.jpeg\" alt=\"jill_2025.jpeg\" width=\"100\" height=\"133\" \/><\/td>\n<td colspan=\"4\"><strong><span style=\"font-size: 16px;\"><a name=\"jill\">Asst. Prof. Carolyn Jill MAYEDA<\/span><\/strong><span style=\"font-size: 12px;\">\uff08Specially Appointed\uff09\u3014Shirane Lab\u3015<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Room<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">S9<\/span><\/td>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Mail-Box<\/strong><\/span><\/td>\n<td><span style=\"font-size: 12px;\">S9-6<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>TEL<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">03-5734-3754<\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>E-mail<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\">mayeda.j.89b2(at)m.isct.ac.jp\u3000<span style=\"font-size: 8pt;\">Please replace &#8220;(at)&#8221; with &#8220;@&#8221;.<\/span><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>HomePage<\/strong><\/span><\/td>\n<td colspan=\"3\"><span style=\"font-size: 12px;\"><a href=\"https:\/\/www. shirane-lab.ee.e.titech.ac.jp\" target=\"_blank\" rel=\"noopener\">https:\/\/www. shirane-lab.ee.e.titech.ac.jp<\/a><\/span><\/td>\n<\/tr>\n<tr>\n<td style=\"background: #f5f5f5;\"><span style=\"font-size: 12px;\"><strong>Current Topics<\/strong><\/span><\/td>\n<td colspan=\"4\">\n<ul>\n<li><span style=\"font-size: 12px;\">SATCOM TRX Phased Arrays<\/span><\/li>\n<li><span style=\"font-size: 12px;\">Heterogeneous TRXs<\/span><\/li>\n<li><span style=\"font-size: 12px;\">GaAs and CMOS IC design<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<table class=\"tableLayout01\" border=\"0\">\n<tbody>\n<tr>\n<td><a href=\"https:\/\/www.first.iir.isct.ac.jp\/cms\/wp-content\/uploads\/research_jill_1.jpg\" rel=\"attachment wp-att-7173\"><img decoding=\"async\" class=\"aligncenter size-full wp-image-7173\" src=\"https:\/\/www.first.iir.isct.ac.jp\/cms\/wp-content\/uploads\/research_jill_1.jpg\" \/><\/a><\/td>\n<td><a href=\"https:\/\/www.first.iir.isct.ac.jp\/cms\/wp-content\/uploads\/research_jill_2.jpg\" rel=\"attachment wp-att-7174\"><img decoding=\"async\" class=\"aligncenter size-full wp-image-7174\" src=\"https:\/\/www.first.iir.isct.ac.jp\/cms\/wp-content\/uploads\/research_jill_2.jpg\" \/><\/a><\/td>\n<\/tr>\n<tr>\n<td style=\"text-align: center;\" colspan=\"2\"><span style=\"font-size: 10px;\">Recent Heterogeneous TRX for SATOM using a 0.1 \u00b5m D-mode GaAs technology and a 65 nm CMOS technology.<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Prof. Hiroyuki ITO Room J2 Mail-Box J2-31 TEL 045-924-5010 E-mail ito(at)nasu.iir.isct.ac.jp\u3000Please replace &#8220;(at)&#8221; with &#8220;@&#8221;. HomePage http:\/\/ateal.jp\/ Research Field Integrated Circuits, RF Circuits, Sensor Networks, IoT and Applictaion Objective Research on interface technology to connect real space and cyberspace Current Topics Ultra Low Power Wireless Sensor Circuit Technology Low Noise Circuit Technology Monitoring Technology for [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":2011,"menu_order":6,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_locale":"en_US","_original_post":"https:\/\/www.first.iir.isct.ac.jp\/?page_id=1931","footnotes":"","_links_to":"","_links_to_target":""},"class_list":["post-2054","page","type-page","status-publish","hentry","en-US"],"_links":{"self":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/pages\/2054","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/comments?post=2054"}],"version-history":[{"count":30,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/pages\/2054\/revisions"}],"predecessor-version":[{"id":9548,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/pages\/2054\/revisions\/9548"}],"up":[{"embeddable":true,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/pages\/2011"}],"wp:attachment":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/media?parent=2054"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}