{"id":12116,"date":"2026-10-29T14:18:27","date_gmt":"2026-10-29T05:18:27","guid":{"rendered":"https:\/\/www.first.iir.isct.ac.jp\/?page_id=12116"},"modified":"2026-10-29T18:02:34","modified_gmt":"2026-10-29T09:02:34","slug":"core22","status":"publish","type":"page","link":"https:\/\/www.first.iir.isct.ac.jp\/en\/member\/core22\/","title":{"rendered":"NCKU GICRC-Semiconductor Division"},"content":{"rendered":"\n\n\n\n\n\n\n\n\n\n
\"ohba_2026.png\"<\/td>\n<\/a>Prof. Takayuki OHBA<\/span><\/strong>\uff08Specially Appointed\uff09\uff08Concurrent Post\uff09<\/span><\/td>\n<\/tr>\n
Room<\/strong><\/span><\/td>\nS9<\/span><\/td>\nMail-Box<\/strong><\/span><\/td>\nS9-11<\/span><\/td>\n<\/tr>\n
TEL<\/strong><\/span><\/td>\n03-5734-2211<\/span><\/td>\n<\/tr>\n
E-mail<\/strong><\/span><\/td>\ntakayuki.ohba(at)first.iir.isct.ac.jp\u3000Please replace “(at)” with “@”.<\/span><\/span><\/td>\n<\/tr>\n
HomePage<\/strong><\/span><\/td>\nhttps:\/\/www.wow.first.iir.isct.ac.jp\/<\/a><\/span><\/td>\n<\/tr>\n
Research Field<\/strong><\/span><\/td>\nBBCube LSI Semiconductor Process Development and Applications<\/span><\/td>\n<\/tr>\n
Objective<\/strong><\/span><\/td>\nTo develop the cutting-edge BBCube three-dimensional large-scale integration technology and drive the semiconductor industry beyond scaling.<\/span><\/td>\n<\/tr>\n
Current Topics<\/strong><\/span><\/td>\n\n
    \n
  • Development of mass-production-ready WOW\/COW processes, equipment, and materials.<\/span><\/li>\n
  • BBCube 2.5D\/3D system development.<\/span><\/li>\n
  • BBCube thermal design and heat dissipation technology development.<\/span><\/li>\n
  • Wide-bandgap materials research.<\/span><\/li>\n
  • Social implementation through the WOW Alliance.<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n\n\n\n
    \"research_ohba_1.png\"<\/td>\n\"research_ohba_2.png\"<\/td>\n<\/tr>\n
    Bumpless vertical interconnects between wafers<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
    \n\n\n\n\n\n\n\n
    \"CHEN2019.jpg\"<\/td>\n<\/a>Prof. Kuan-Neng CHEN<\/span><\/strong>\uff08Specially Appointed\uff09\u3014Ito Lab\u3015\uff08Concurrent Post\uff09<\/span><\/td>\n<\/tr>\n
    Room<\/strong><\/span><\/td>\nJ3<\/span><\/td>\nMail-Box<\/strong><\/span><\/td>\nJ3-132<\/span><\/td>\n<\/tr>\n
    TEL<\/strong><\/span><\/td>\n045-924-5866<\/span><\/td>\n<\/tr>\n
    E-mail<\/strong><\/span><\/td>\nchien.k.0dea(at)m.isct.ac.jp\u3000Please replace “(at)” with “@”.<\/span><\/span><\/td>\n<\/tr>\n
    HomePage<\/strong><\/span><\/td>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
    \n\n\n\n\n\n\n\n\n\n\n
    \"chujo_2025.jpg\"<\/td>\n<\/a>Prof. Norio CHUJO<\/span><\/strong>\uff08Specially Appointed\uff09\u3014Ito Lab\u3015\uff08Concurrent Post\uff09<\/span><\/td>\n<\/tr>\n
    Room<\/strong><\/span><\/td>\nR2\u68df<\/span><\/td>\nMail-Box<\/strong><\/span><\/td>\nR2-32<\/span><\/td>\n<\/tr>\n
    TEL<\/strong><\/span><\/td>\n045-924-5083<\/span><\/td>\n<\/tr>\n
    E-mail<\/strong><\/span><\/td>\nchuujou.n.813f(at)m.isct.ac.jp\u3000Please replace “(at)” with “@”.<\/span><\/span><\/td>\n<\/tr>\n
    HomePage<\/strong><\/span><\/td>\nhttps:\/\/www.wow.first.iir.isct.ac.jp\/<\/a><\/span><\/td>\n<\/tr>\n
    Research Field<\/strong><\/span><\/td>\nDesign and architecture of BBCube 3D integration<\/span><\/td>\n<\/tr>\n
    Objective<\/strong><\/span><\/td>\nDevelopment of semiconductor technologies that achieve both high performance and low.<\/span><\/td>\n<\/tr>\n
    Current Topics<\/strong><\/span><\/td>\n\n
      \n
    • Research and development of BBCube 3D systems stacking xPUs (e.g., CPUs and GPUs), memory, and voltage regulators<\/span><\/li>\n
    • Development of low-power, high-bandwidth inter-chip communication technologies for 2.5D\/3D integration<\/span><\/li>\n
    • Development of vertically integrated high-efficiency power delivery solutions<\/span><\/li>\n
    • Advanced thermal design and heat dissipation technology development <\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n\n\n\n
      \"\"<\/a><\/td>\n<\/tr>\n
      BBCube 3D configuration<\/span>
      \n\u30fbMulti-xPU\/IVR\/Multi-Memory Vertical Stack<\/span>
      \n\u30fbWOW and COW Hybrid Processes<\/span>
      \n\u30fbCu-Damascene Via-Last TSVs)<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
      \n\n\n\n\n\n\n\n\n\n\n
      \"yoda_2022.jpg\"<\/td>\nProf. Takashi YODA<\/strong>\uff08Specially Appointed\uff09\u3014Ohba Lab\u3015\uff08Concurrent Post\uff09<\/span><\/span><\/td>\n<\/tr>\n
      Room<\/strong><\/span><\/td>\nR2\u68df<\/span><\/td>\nMail-Box<\/strong><\/span><\/td>\nR2-32<\/span><\/td>\n<\/tr>\n
      TEL<\/strong><\/span><\/td>\n045-924-5083<\/span><\/td>\n<\/tr>\n
      E-mail<\/strong><\/span><\/td>\ntakashi.yoda(at)first.iir.isct.ac.jp\u3000Please replace “(at)” with “@”.<\/span><\/span><\/td>\n<\/tr>\n
      HomePage<\/strong><\/span><\/td>\nhttps:\/\/www.wow.first.iir.isct.ac.jp\/<\/a><\/span><\/td>\n<\/tr>\n
      Research Field<\/strong><\/span><\/td>\nWide Band Gap (WBG) Semiconductor Technology<\/span><\/td>\n<\/tr>\n
      Objective<\/strong><\/span><\/td>\nDevelopment of the High performance SiC\/(GaN) devices<\/span><\/td>\n<\/tr>\n
      Current Topics<\/strong><\/span><\/td>\n\n
        \n
      • Defect-Free Engineering<\/span>
        \n\u3000- Lifetime Measurement<\/span>
        \n\u3000- Dislocation Modeling<\/span><\/li>\n
      • Diagnotics Technology<\/span><\/li>\n
      • Advanced Application of WBG Devices<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n\n\n\n
        \"research_yoda_1.png\"<\/td>\n\"research_yoda_2.png\"<\/td>\n<\/tr>\n
        Lifetime measurement for n-Buffer SiC layer<\/span><\/td>\nHyperspectral Raman Imaging of 4H-SiC BPD<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
        \n\n\n\n\n\n\n\n\n\n\n
        \"yskim2016.jpg\"<\/td>\nProf. Young Suk KIM<\/span><\/strong>\uff08Visiting\uff09\u3014Ito Lab\u3015\uff08Concurrent Post\uff09<\/span><\/td>\n<\/tr>\n
        Room<\/strong><\/span><\/td>\nJ3<\/span><\/td>\nMail-Box<\/strong><\/span><\/td>\nJ3-132<\/span><\/td>\n<\/tr>\n
        TEL<\/strong><\/span><\/td>\n045-924-5866<\/span><\/td>\n<\/tr>\n
        E-mail<\/strong><\/span><\/td>\nyoungsuk.k.aa(at)m.titech.ac.jp\u3000Please replace “(at)” with “@”.<\/span><\/span><\/td>\n<\/tr>\n
        HomePage<\/strong><\/span><\/td>\nhttp:\/\/www.wow.pi.titech.ac.jp\/<\/a><\/span><\/td>\n<\/tr>\n
        Research Field<\/strong><\/span><\/td>\nProcess Integration Development for 3D LSI Devices<\/span><\/td>\n<\/tr>\n
        Objective<\/strong><\/span><\/td>\nTo develop ultra-thinning of 300-mm device wafers and those stack process integration technology for three-dimensional LSI technology. Because the physical interconnects length becomes 1\/10 using ultra-thin wafers and Wafer-on-Wafer (WOW) process, high performance 3D devices with low power consumption will be realized.<\/span><\/td>\n<\/tr>\n
        Current Topics<\/strong><\/span><\/td>\n\n
          \n
        • Ultra-thinning 300-mm DRAM wafer down to 2-\u03bcm<\/span><\/li>\n
        • Bumpless vertical interconnects between wafers<\/span><\/li>\n
        • Analyses of defect generation and device characteristics for thinned device wafer<\/span><\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

          \"research_yskim.png\"
          \nThinned DRAM 300mm wafer<\/p>\n","protected":false},"excerpt":{"rendered":"

          Prof. Takayuki OHBA\uff08Specially Appointed\uff09\uff08Concurrent Post\uff09 Room S9 Mail-Box S9-11 TEL 03-5734-2211 E-mail takayuki.ohba(at)first.iir.isct.ac.jp\u3000Please replace “(at)” with “@”. HomePage https:\/\/www.wow.first.iir.isct.ac.jp\/ Research Field BBCube LSI Semiconductor Process Development and Applications Objective To develop the cutting-edge BBCube three-dimensional large-scale integration technology and drive the semiconductor industry beyond scaling. Current Topics Development of mass-production-ready WOW\/COW processes, equipment, and materials. […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":2011,"menu_order":23,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_locale":"en_US","_original_post":"https:\/\/www.first.iir.isct.ac.jp\/?page_id=12114","footnotes":"","_links_to":"","_links_to_target":""},"class_list":["post-12116","page","type-page","status-publish","hentry","en-US"],"_links":{"self":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/pages\/12116","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/comments?post=12116"}],"version-history":[{"count":3,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/pages\/12116\/revisions"}],"predecessor-version":[{"id":12148,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/pages\/12116\/revisions\/12148"}],"up":[{"embeddable":true,"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/pages\/2011"}],"wp:attachment":[{"href":"https:\/\/www.first.iir.isct.ac.jp\/wp-json\/wp\/v2\/media?parent=12116"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}