TOP > NCKU GICRC-Semiconductor Division

NCKU GICRC-Semiconductor Division

	Prof. Takayuki OHBA（Specially Appointed）（Concurrent Post）
	Room	S9	Mail-Box	S9-11
	TEL	03-5734-2211
	E-mail	takayuki.ohba(at)first.iir.isct.ac.jp　Please replace “(at)” with “@”.
	HomePage	https://www.wow.first.iir.isct.ac.jp/
Research Field	BBCube LSI Semiconductor Process Development and Applications
Objective	To develop the cutting-edge BBCube three-dimensional large-scale integration technology and drive the semiconductor industry beyond scaling.
Current Topics	Development of mass-production-ready WOW/COW processes, equipment, and materials. BBCube 2.5D/3D system development. BBCube thermal design and heat dissipation technology development. Wide-bandgap materials research. Social implementation through the WOW Alliance.


Bumpless vertical interconnects between wafers

	Prof. Kuan-Neng CHEN（Specially Appointed）〔Ito Lab〕（Concurrent Post）
	Room	J3	Mail-Box	J3-132
	TEL	045-924-5866
	E-mail	chien.k.0dea(at)m.isct.ac.jp　Please replace “(at)” with “@”.
	HomePage

	Prof. Norio CHUJO（Specially Appointed）〔Ito Lab〕（Concurrent Post）
	Room	R2棟	Mail-Box	R2-32
	TEL	045-924-5083
	E-mail	chuujou.n.813f(at)m.isct.ac.jp　Please replace “(at)” with “@”.
	HomePage	https://www.wow.first.iir.isct.ac.jp/
Research Field	Design and architecture of BBCube 3D integration
Objective	Development of semiconductor technologies that achieve both high performance and low.
Current Topics	Research and development of BBCube 3D systems stacking xPUs (e.g., CPUs and GPUs), memory, and voltage regulators Development of low-power, high-bandwidth inter-chip communication technologies for 2.5D/3D integration Development of vertically integrated high-efficiency power delivery solutions Advanced thermal design and heat dissipation technology development

BBCube 3D configuration
・Multi-xPU/IVR/Multi-Memory Vertical Stack
・WOW and COW Hybrid Processes
・Cu-Damascene Via-Last TSVs)

	Prof. Takashi YODA（Specially Appointed）〔Ohba Lab〕（Concurrent Post）
	Room	R2棟	Mail-Box	R2-32
	TEL	045-924-5083
	E-mail	takashi.yoda(at)first.iir.isct.ac.jp　Please replace “(at)” with “@”.
	HomePage	https://www.wow.first.iir.isct.ac.jp/
Research Field	Wide Band Gap (WBG) Semiconductor Technology
Objective	Development of the High performance SiC/(GaN) devices
Current Topics	Defect-Free Engineering 　- Lifetime Measurement 　- Dislocation Modeling Diagnotics Technology Advanced Application of WBG Devices


Lifetime measurement for n-Buffer SiC layer	Hyperspectral Raman Imaging of 4H-SiC BPD

	Prof. Young Suk KIM（Visiting）〔Ito Lab〕（Concurrent Post）
	Room	J3	Mail-Box	J3-132
	TEL	045-924-5866
	E-mail	youngsuk.k.aa(at)m.titech.ac.jp　Please replace “(at)” with “@”.
	HomePage	http://www.wow.pi.titech.ac.jp/
Research Field	Process Integration Development for 3D LSI Devices
Objective	To develop ultra-thinning of 300-mm device wafers and those stack process integration technology for three-dimensional LSI technology. Because the physical interconnects length becomes 1/10 using ultra-thin wafers and Wafer-on-Wafer (WOW) process, high performance 3D devices with low power consumption will be realized.
Current Topics	Ultra-thinning 300-mm DRAM wafer down to 2-μm Bumpless vertical interconnects between wafers Analyses of defect generation and device characteristics for thinned device wafer

Thinned DRAM 300mm wafer

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国立大学法人東京科学大学
　総合研究院　未来産業技術研究所

Laboratory for Future Interdisciplinary Research of Science and Technology (FIRST),
Institute of Integrated Research (IIR),
Institute of Science Tokyo

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